Material Type

Wafers are commonly made from materials such as:

• Silicon (Si)
• Sapphire (Al₂O₃)
• Silicon Carbide (SiC)
• Gallium Arsenide (GaAs)
• Quartz

Your Name:

Company:

Your email:

Your message:

Send

Diameter

Common wafer diameters include:

• 100 mm (4 inches)
• 150 mm (6 inches)
• 200 mm (8 inches)
• 300 mm (12 inches)

Thickness

Typical thickness depends on wafer diameter:

• 525 µm for 100 mm wafers
• 675 µm for 150 mm wafers
• 725 µm for 200 mm wafers

Orientation

Silicon wafer orientations:

• <100>: General-purpose research
• <111>: Etching experiments
• <110>: Specialized applications

Coatings

Common wafer coatings include:

• Thermal Oxide
• Nitride
• Photoresist
• Epitaxial Layers